Via On Via
- Company Name:DAP Corporation
- Membership:Free Member
- Member Since:2003. 09.22
- Country/Region:Korea
- City:Gyeonggi-do
- Contact:Moon-sik, Choi
- Related Keywords:PCB, DAP Corporation, Via on Via, Hybrid Board, HDI
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DAP Corporation
[Korea]
Specification
| Layer Count | 8 Layer |
| Material | FR-4 & RCC |
| Board Thickness | 0.039" +/-10% |
| Min Line/Space | Inner layer : 0.05/0.04 & Outer layer : 0.05/0.04 |

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